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India and Singapore Strengthen Ties with 4 MoUs on Semiconductors, Digital Tech, and Health

Shailaja Pathak
Shailaja Pathak·Sep 6, 2024·2 min read
Indian PM Modi and Singapore PM Lawrence Wong at a meeting during Modi's two-day visit to Singapore

On Thursday, India and Singapore elevated their ties to a “comprehensive strategic partnership” and signed four MoUs during talks between Prime Minister Modi and Singapore’s Lawrence Wong.

The Memorandum of Understanding (MoU) was signed during Indian Prime Minister Narendra Modi's two-day visit to Singapore, his first since 2018 and fifth overall.

The first MoU, signed by India’s Ministry of Electronics and Information Technology and Singapore’s Ministry of Digital Development and Information, will foster cooperation in digital technologies, including DPI, cyber-security, 5G, supercomputing, quantum computing, and AI, and support upskilling and reskilling in the digital field.

The MoU on the India-Singapore semiconductor partnership was signed by India’s Ministry of Electronics and Information Technology and Singapore’s Ministry of Trade and Industry. It will support the development of a semiconductor cluster, enhance talent in semiconductor design and manufacturing, and encourage Singaporean investments in India.

Another MoU, signed by India’s Ministry of Health and Family Welfare and Singapore’s Ministry of Health, focuses on health and medicine. The agreement will advance joint research and innovation, enhance cooperation in healthcare and pharmaceutical training, and support New Delhi’s efforts to promote Indian healthcare professionals in Singapore.

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Modi in his opening remarks thanked Wong for receiving a ceremonial and warm welcome. 

“This is our first meeting after you assumed the post of premier. Many congratulations to you from my side. I am confident that under the leadership of 4G (the fourth-generation leaders), Singapore will progress even faster,” Modi said.

Prime Minister Modi expressed his desire to create many "Singapores" in India and is pleased with the collaborative efforts. He called the new ministerial roundtable a groundbreaking mechanism. 

He added that this initiative is defined by partnerships in areas such as skilling, digitalization, mobility, advanced manufacturing, semiconductors, AI, healthcare, sustainability, and cyber security.


Edited by Harshajit Sarmah

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